Multi-chip package (MCP) is based on the unified design of different storage technologies and processes on the same substrate. The revolutionary chip stack technology can optimize the circuit board design and save space. XTX designed different storage technology product solutions, including SLC NAND Flash and low-power consumption LPDDR2/LPDDR4X of mobile DRAM on a single substrate. This highly integrated design method can bring many advantages:
1. Improve storage performance and integration, and establish the shortest and most stable connection by stacking two storage modules together;
2. Save 30%-40% design area of PCB board of the end product, relative to the solution of discrete device;
3. Reduce the number of components in BOM, and reduce the costs of procurement, logistics, operation and processing;
4. Accelerate product development and shorten the time to market.

XTX MCP product line has many storage configurations, primarily based on 2-die and 3-die stack package. Among which, the most mainstream combination is 1Gb + 512Mb; 1Gb+1Gbit; 2Gb+1Gb; 2Gbit+2Gb; 4Gb+2Gb; 4Gb+4Gb (NAND and low-power consumption DRAM)

Whether you want to reduce power consumption, leave more space for a PCB board, or speed up your product, XTX MCP products can satisfy your different application design needs. Our efficient, high-performance MCP will be an indispensable design element in your mobile product design.