XTX XT70 series is a multi-chip package (MCP) storage solution, consisting of a serial NOR flash die and a serial PSRAM die. The system integrated package design with different types of memories brings many advantages for customer design:
1. Reduce end products PCBA area while improving the data access speed;
2. Extend SoC embedded Flash and PSRAM density limitation, and realize flexible configuration to meet personalized needs;
3. LGA16 5x6mm solves the space shortage for wearable and miniaturized package adaptor module.
This miniaturized, high-performance MCP is suitable for supporting fast access to smart audio and video modules, wearable and IoT products.